Clasificar por
INIS
deposition
100%
variations
100%
voltage
100%
substrates
100%
thin films
100%
residual stresses
100%
titanium nitrides
100%
films
80%
values
60%
incidents
40%
depth
20%
increasing
20%
x-ray diffraction
20%
layers
20%
thickness
20%
steels
20%
magnetrons
20%
penetration depth
20%
diffraction methods
20%
sputtering
20%
grazing
20%
gas flow
20%
Keyphrases
Residual Stress
100%
Titanium Nitride Thin Films
100%
Substrate Bias Voltage
100%
Incident Angle
66%
Bias Voltage
66%
X-ray Diffraction Method
33%
Residual Stress Gradient
33%
Penetration Depth
33%
Grazing Incidence X-ray Diffraction (GIXRD)
33%
Residual Stress Measurement
33%
Film Thickness
33%
Steel Substrate
33%
Magnetron Sputtering
33%
Substrate Bias
33%
Compressive Residual Stress
33%
Gas Pressure
33%
Gas Flow
33%
Triode
33%
M2 High-speed Steel
33%
Titanium Nitride Film
33%
D2 Steel
33%
Sequence of Steps
33%
Engineering
Substrate Bias
100%
Bias Voltage
100%
Thin Films
100%
Residual Stress
100%
Nitride
100%
Incident Angle
66%
Penetration Depth
33%
Stress Gradient
33%
Magnetron
33%
Ray Diffraction Method
33%
Residual Stress Measurement
33%
Deposited Film
33%
Compressive Residual Stress
33%
Individual Layer
33%
Gas Flow
33%
X Ray Diffraction
33%
Material Science
Titanium
100%
Nitride Compound
100%
Residual Stress
100%
Thin Films
100%
Film
60%
X-Ray Diffraction
20%
Magnetron Sputtering
20%
Stress Measurement
20%
Film Thickness
20%
Gas Flow
20%