TY - GEN
T1 - Integrated CMOS class-E power amplifier for self-sustaining wireless power transfer system
AU - Jaimes, Arturo Fajardo
AU - De Sousa, Fernando Rangel
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/10/27
Y1 - 2016/10/27
N2 - In this paper is proposed a methodology for designing a CMOS class-E PA used to drive an inductive link. In order to satisfy the operating conditions imposed by the PA specifications and the available technology, a differential class-E PA with split slab inductor and high level of integration was both designed and simulated. The proposed methodology uses the analytical solution of the ideal class-E PA equations as the first point of an iterative procedure for solving the optimization of the PA. Further, the proposed design set solve the trade-off between ON-resistance and gate capacitance of the switches, resulting in the optimal choice of the power transistors width for a class-E PA with finite DC-feed inductance. In the post-layout simulation, the PAE of the PA was 45.7% when 20.7 dBm.
AB - In this paper is proposed a methodology for designing a CMOS class-E PA used to drive an inductive link. In order to satisfy the operating conditions imposed by the PA specifications and the available technology, a differential class-E PA with split slab inductor and high level of integration was both designed and simulated. The proposed methodology uses the analytical solution of the ideal class-E PA equations as the first point of an iterative procedure for solving the optimization of the PA. Further, the proposed design set solve the trade-off between ON-resistance and gate capacitance of the switches, resulting in the optimal choice of the power transistors width for a class-E PA with finite DC-feed inductance. In the post-layout simulation, the PAE of the PA was 45.7% when 20.7 dBm.
KW - Class-E
KW - power amplifier
KW - power efficiency
KW - wireless power transfer
UR - https://www.scopus.com/pages/publications/85000376723
U2 - 10.1109/SBCCI.2016.7724043
DO - 10.1109/SBCCI.2016.7724043
M3 - Conference contribution
AN - SCOPUS:85000376723
T3 - Proceedings - SBCCI 2016: 29th Symposium on Integrated Circuits and Systems Design: Chip on the Mountains
BT - Proceedings - SBCCI 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th Symposium on Integrated Circuits and Systems Design, SBCCI 2016
Y2 - 29 August 2016 through 3 September 2016
ER -