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Residual stress gradient of Cr and CrN thin films
D. F. Arias
,
A. Gómez
, R. M. Souza
, J. M. Vélez
Department of Civil and Industrial Engineering
Seismic Engineering and Materials Research Group (SIGMA)
Universidad Católica de Pereira
Universidade de São Paulo
Universidad Nacional de Colombia
Research output
:
Contribution to journal
›
Article
›
peer-review
19
Scopus citations
Overview
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Keyphrases
Residual Stress
100%
Residual Stress Gradient
100%
CrN Thin Film
100%
Structural Characterization
50%
Monocrystalline Silicon
50%
Surface Stress
50%
Tensile Stress
50%
Incidence Angle
50%
Magnetron Sputtering Deposition
50%
X-ray Diffraction Method
50%
Penetration Depth
50%
CrN Film
50%
Film-substrate Interface
50%
Synchrotron Light
50%
High Stress
50%
Grazing Incidence X-ray Diffraction (GIXRD)
50%
Laplace Transform
50%
Multilayer Film
50%
Residual Stress Measurement
50%
Depth Profile
50%
Tensile Residual Stress
50%
INIS
thin films
100%
residual stresses
100%
chromium nitrides
100%
layers
66%
films
66%
values
33%
surfaces
33%
substrates
33%
data
16%
depth
16%
x-ray diffraction
16%
laboratories
16%
interfaces
16%
experimental data
16%
thickness
16%
magnetrons
16%
laplace transformation
16%
silicon
16%
penetration depth
16%
brazilian lnls synchrotron
16%
angle of incidence
16%
diffraction methods
16%
sputtering
16%
grazing
16%
Material Science
Residual Stress
100%
Thin Films
100%
Film
60%
Surface (Surface Science)
40%
X-Ray Diffraction
20%
Monolayers
20%
Ultimate Tensile Strength
20%
Silicon
20%
Multilayer Film
20%
Magnetron Sputtering
20%
Stress Measurement
20%
Physics
Residual Stress
100%
Thin Films
100%
Synchrotron
20%
Ultimate Tensile Strength
20%
X-Ray Diffraction
20%
Magnetron Sputtering
20%
Engineering
X Ray Diffraction
33%